Design and implementation of microcirculation cooling device for microelectronic devices based on electrostatic force

Abstract This paper presents the design of a cooling device for microelectronic applications. The proposed uses parallel plate capacitor electrical bias to generate an electrostatic force that acts on coolant enable control flow in radiator. Through combination structural and application both sides multiple electrodes, generation radiator eddy current is realized, functions heat transfer are realized devices placed surface base platform. Based this principle, finite element multi-physical field simulation was used simulate function under action effects channel diameter, spacing, voltage, liquid storage tank depth peak velocity were studied. In addition, 3D printing technology fabricate dissipation device. tested by charging, with basic realization controlling demonstrated. realizes rate through voltage has characteristics include low energy consumption convenient compact structure.